Guohao Dai

Guohao Dai

An undergraduate student at Shenzhen University

Guohao Dai (戴国浩)

Guohao Dai has received his B.Eng. degree in 2023 from Shenzhen University, China. He is currently an M.Phil. student at Hong Kong University of Science and Technology (Guangzhou) and conducts research on Electronic Design Automation under the supervision of Prof. Yuzhe Ma.

Education

  • M.Phil., HKUST(GZ), China Sept. 2024 - Jun. 2025 (Expected)
    • Major: Microlectronics.
    • GPA: N/A.
  • B.Eng., Shenzhen University, China Sept. 2019 - Jun. 2023
    • Major: Automation.
    • GPA: 90.0/100.0 (rank 1/147). transcript

Selected Publications

  • ICCAD’23 Y. Liu, G. Dai, Y. Cheng, W. Kang, W. W. Xing, “OPT: Optimal Proposal Transfer for Efficient Yield Optimization for Analog and SRAM Circuits”. International Conference on Computer-Aided Design (ICCAD), 2023. (Best Paper Award Nomination) pdf
  • DAC’23 Y. Liu*, G. Dai*, W. W. Xing, “Seeking the Yield Barrier: High-Dimensional SRAM Evaluation Through Optimal Manifold”. Design Automation Conference (DAC), 2023. (*Equal contribution) pdf
  • ASPDAC’23 S. Yin*, G. Dai*, W. W. Xing, “High-Dimensional Yield Estimation using Shrinkage Deep Features and Maximization of Integral Entropy Reduction”. Asia and South Pacific Design Automation Conference (ASP-DAC), 2023. (*Equal contribution) pdf