Guohao Dai (戴国浩)

Guohao Dai has received his B.Eng. degree in 2023 from Shenzhen University, China. Previously, He engaged in research under the supervision of Prof. Wei W. Xing. He is familiar with yield analysis of circuits and multi-fidelity fusion models.

Education

• B.Eng., Shenzhen University, China Sept. 2019 - Jun. 2023
  • Major: Automation.
  • GPA: 90.0/100.0 (rank 1/147). transcript

Selected Publications

• ICCAD’23 Y. Liu, G. Dai, Y. Cheng, W. Kang, W. W. Xing, “OPT: Optimal Proposal Transfer for Efficient Yield Optimization for Analog and SRAM Circuits”. International Conference on Computer-Aided Design (ICCAD), 2023. (Best Paper Award Nomination) pdf
• DAC’23 Y. Liu*, G. Dai*, W. W. Xing, “Seeking the Yield Barrier: High-Dimensional SRAM Evaluation Through Optimal Manifold”. Design Automation Conference (DAC), 2023. (*Equal contribution) pdf
• ASPDAC’23 S. Yin*, G. Dai*, W. W. Xing, “High-Dimensional Yield Estimation using Shrinkage Deep Features and Maximization of Integral Entropy Reduction”. Asia and South Pacific Design Automation Conference (ASP-DAC), 2023. (*Equal contribution) pdf